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Briefing
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- Hybrid 3D Chip – Stanford and MIT researchers designed new 3D chip that combines both computation and data storage, processing logic and memory at same time, solving data communication bottleneck experienced by current systems
- Novel Material – Replaces silicon with carbon nanotubes, which are 2D graphene sheets formed into nanocylinders, enabling transistors to scale beyond limits of conventional silicon chip technology
- New 3D Computer Architecture – Comprised of vertically stacked layers of two million carbon nanotube field-effect transistors (CNFETs) and one million resistive random access memory (RRAM) cells, non-volatile memory technology denser, faster, and more energy efficient than dynamic random access memory (DRAM), connected by ultra-dense through-chip wires
- Moore’s Law Continuation – Can sustain Moore’s Law, which posits that number of transistors in integrated circuit doubles every two years, as 3D integration allows for more devices to be included per unit volume
- Silicon Infrastructure Compatibility – Compatible with existing silicon infrastructure in fabrication and design
- Application – Makes for highly efficient and fast computing chips for large data applications such as neural networks, autonomous cars, and personalized medicine
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