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Briefing
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- 3D Packing Technology – Intel demonstrated its new 3D packing technology called Foveros that allows chips to be layered on top of each other at Intel Architecture Day on December 11, 2018
- New Method – Intel’s vertical solution can enable continuation of Moore’s Law, which posits that chips will continue to get smaller while packing more transistors
- Vertical Solution – Can pack more transistors, as well as include more functionalities, such as 5G radio, central processing unit (CPU) and more, in given space
- Prevents Heating – Solved heating problem that normally occurs when chips are stacked by inventing insulation material to dissipate heat, conducting more tests, and developing new power delivery process
- Supporting Products – Consumer products using Foveros expected to launch in 2019
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